金刚石体积分数对金刚石/铜基复合材料性能的影响

Effects of Diamond Volume Fraction on Properties of Diamond/copper Composites

采用直热法粉末触变成形工艺制备不同体积分数(40%、50%、60%、70%)的金刚石/铜基复合材料,通过对其热导率、抗弯强度、热膨胀系数的测定,得到金刚石体积分数对金刚石/铜基复合材料组织和性能的影响。结果表明,金刚石体积分数的增加,不利于金刚石和铜的界面结合。金刚石体积分数为50%时,复合材料的热导率和抗弯强度最高,分别为200.028 W/(m·K)和406.39 MPa。另外在200℃的热膨胀系数为6.299×10^(-6)℃^(-1)。

The diamond/Cu composites with different volume fractions of diamond(50%, 60%, 70%) were prepared by direct thermal powder thixoforming process. By measuring the thermal conductivity, bending strength and thermal expansion coefficient, the influence of diamond volume fraction on the microstructure and properties of diamond/Cu composites was analyzed. The results indicate that the increase of diamond volume fraction is adverse to the interfacial bonding between diamond and copper.When the diamond volume fraction is 50%, the thermal conductivity and bending strength of the composites reach the maximum, which are 200.028 W/(m·K) and 406.39 MPa, respectively, and the thermal expansion coefficient reaches 6.299×10^(-6)℃^(-1)at 200 ℃.