光学晶体精密加工亚表面损伤缺陷的检测方法

Detection of Subsurface Damage Defects in Precision Machining of Optical Crystals

随着光学晶体精密加工技术的飞速发展,现代电子学、短波和强波光学对所用材料的选择标准越来越高。光学晶体表面要求达到超光滑标准,即晶体表面的粗糙度必须小于1 nm,不能有破损痕迹和任何表层应力。因此,保证超精密加工技术的合理应用和光学晶体的质量尤为重要。文章探究了光学晶体的超精密加工方法和亚表面损伤缺陷的检测方法,希望能够严格把控光学晶体的质量。

With the rapid development of optical crystal precision processing technology, modern electronics, short wave and strong wave optics have higher and higher standards for the selection of materials. The surface of the optical crystal is required to meet the ultra smooth standard, that is, the roughness of the crystal surface must be less than 1 nm, without damage marks and any surface stress. It is particularly important to ensure the reasonable application of ultra precision machining technology and the quality of the optical crystal. This paper explores the ultra precision processing method of optical crystals and the detection method of sub surface damage defects, hoping to strictly control the quality of optical crystals.