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粘接胶层对结式铁氧体开关磁芯温度的影响

Influence of bingding glue layer on the temperature of magnetic core of junction ferrite switch
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摘要 散热效率是大功率结式铁氧体开关可靠性的关键因素。计算分析出影响铁氧体开关热流通道中的主要热阻,为粘结面的胶层。利用仿真软件,对铁氧体开关的散热进行分析。结果表明,粘结面胶层越厚,其热阻越大,散热效率越差;热流通道上胶层缺失,将严重降低铁氧体开关的散热效率。由此,利用装配夹具以控制胶层合理的厚度,保证胶层在热流通道上均匀完整,可有效保证结式铁氧体开关的可靠性。 The efficiency of heat dissipation of junction ferrite switch is key factor to its reliability.The main thermal resistance of junction ferrite switch is the glue layer of bonding plane by calculation and analysis.Analysis of heat dissipation to junction ferrite switch by using simulation software two points can be concluded.One is that the thicker glue layer of bonding surface,the higher thermal resistance,which leads weaker heat dissipation efficiency.The other is that the deficiency of glue layer on heat transfer channel will result in bad heat dissipation efficiency in junction ferrite switch.Therefore,to improve the reliability of junction ferrite switch,glue layer need to be controlled in reasonable thickness,besides,uniform distribution and completeness of glue layer is also very important.
作者 李鹏 王金红 张华峰 田珺宏 LI Peng;WANG Jin-hong;ZHANG Hua-feng;TIAN Jun-hong(Southwest Institute of Applied Magnetics,Mianyang 621000,China;AECC Sichuan gas turbine research establishment,Mianyang 621000,China)
出处 《磁性材料及器件》 CAS CSCD 2022年第6期82-86,共5页 Journal of Magnetic Materials and Devices
关键词 结式铁氧体开关 粘接 散热 胶层 热阻 junction ferrite switch binding heat dissipation glue layer thermal resistance
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