X射线测厚仪测量压延铜箔厚度精度的影响因素及故障处理

Affecting Factors and Fault Treatment of the Accuracy of X-ray Thickness Gauge for Rolled Copper Foil

东芝X射线测厚仪是X型铜箔轧机的关键检测设备及厚控系统(AGC)的重要组成部分,其精确的厚度测量功能是保证轧机厚度控制有效的基本条件。基于测厚仪的构成和测量原理,对满量程校准和精度验证的机理进行分析研究,对标样箱内部标准样板脱落、x射线发生器劣化等故障,采取切实有效的措施,提高了测厚仪运行稳定性和测量精度。

X-ray thickness gauge made by Toshiba is the key testing equipment and an important part of automatic thickness control system(AGC) of X mill for copper foil rolling. It is the basic condition to ensure the effective and correct thickness control of the mill that the thickness gauge has the function of accurate thickness measurement. We analyze and study the mechanism of full calibration and precision verification based on the composition and measurement principle of thickness gauge. Effective measures are taken to improve the accuracy, stability and reliability of the thickness gauge in view of the failure of the standard plate falling off inside the standard changer and the deterioration of the X-ray generator.