期刊文献+

高精度、高量程加压机构的有限元分析

The Finite Element Analysisi of High Precision and High Range Pressurizing Mechanism
下载PDF
导出
摘要 通过SolidWorks软件建立了高精度、高量程加压机构的三维模型;采用ANSYS软件建立了有限元计算模型。通过静力分析,得出了加压机构的应力、变形结果;通过模态分析,得出了加压机构1~6阶的固有频率、振型。根据计算结果得出加压机构的结构刚度、强度较好;相邻阶次的固有频率差别较小,动态性能较好。对加压机构进行拓扑优化,得出优化结果,为设计提供改进方向。 The three-dimensional model of high precision and high range pressurizing mechanism is established by Solid Works software;the finite element calculation model is established by ANSYS software.Through static analysis,the stress and deformation results of the pressurizing mechanism are obtained.Through modal analysis,the natural frequencies and mode shapes of the 1st to 6th order of the headstock are obtained.According to the calculation results,it is known that the structural rigidity and strength of the pressurizing mechanism are better.The natural frequency difference of adjacent orders is small,and the dynamic performance is better.The topology optimization of the compression mechanism is carried out,and the optimization result is obtained,which provides a reference for the subsequent design.
作者 孟超 张志耀 田芳 韦杰 温岩 Meng Chao;Zhang Zhiyao;Tian Fang;Wei Jie;Wen Yan(The 2nd Research Institute of CETC,Taiyuan Shanxi 030024)
出处 《机械管理开发》 2022年第11期57-58,61,共3页 Mechanical Management and Development
关键词 加压机构 有限元 静力分析 模态分析 pressurizing mechanism finite element stress analysis modal analysis
  • 相关文献

参考文献2

二级参考文献18

  • 1王学林,徐岷,胡于进.机床模态特性的有限元分析[J].机床与液压,2005,33(2):48-49. 被引量:61
  • 2杨晓京,傅中裕,刘剑雄.基于ANSYS的XK640数控铣床立柱优化设计[J].机械设计与制造,2006(11):73-74. 被引量:10
  • 3毕承恩 丁乃建.现代数控机床[M].北京:机械工业出版社,1993,7..
  • 4李洁,蹇兴东,史庆春.机床立柱结构动态特性分析及优化设计[J].现代制造工程,2007(9):129-131. 被引量:12
  • 5Kusamitsu H, Morishita Y, Maruhashi K, ho M, Ohata K. The flip-chip bump interconnection for millimeter-wave GaAs MMIC [ C ]. 1998 International Conference on Muhichip Modules and High Density Packaging, IEEE, 47 -52
  • 6Takashi Yoshida, Tadayoshi Deguchi, Kiyoshi Kawaguchi and Atsushi Nakagawa. KA-BAND PLANAR GUNN OSCIL- LATORS USING FLIP- CHIP GAAS GUNN DIODES FABRICATED BY BORON IMPLANTATION [ J ]. 2000 IEEE GaAs Digest, 165 - 169
  • 7Mark S. Hauhe,John J. Wooldridge. High density packaging of X-band active array modules [ J ]. 1997 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY - PART B. 20 ( 3 ) ,279 - 291
  • 8Wong A, Linton D. Copper flip chip bump interconnect technology for microwave subsystems including RF characterization[ C ]. 2000 Electronics Packaging Technology Conference ,335 - 338
  • 9Wong A, Linton D. Application of SU-8 in flip chip bump micromachining for millimeter wave applications [ C ]. 2000 Electronics Packaging Technology Conference ,204 -209
  • 10Norihito Tsukahara, Kazushi Higashi. Development of 2 Stage bump forming method using wire bonding technique [ J ]. Electronic Manufacturing Technology Symposium, 1995 : 291 - 295

共引文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部