Ni-Cu泡沫/Sn-9Zn复合焊料超声钎焊蓝宝石/Al合金接头的组织及性能研究

Study on Microstructure and Properties of Sapphire/Al Joints Ultrasonic Soldered with Ni-Cu Foam Reinforced Sn-9Zn Composite Solder

为实现蓝宝石玻璃和Al合金的低温钎焊连接,采用Ni-10wt%Cu合金泡沫强化Sn-9wt%Zn复合焊料(NiCu-Sn9Zn)超声钎焊蓝宝石/Al合金异质母材,重点研究了钎焊温度及超声振动时间对接头冶金反应行为及力学性能的影响。结果表明,蓝宝石/NiCu-Sn9Zn/Al接头的钎缝层由Sn基体、棒状η-Zn相、α-Al颗粒、合金骨架及其表面的Al3Ni金属间化合物(Intermetallic compounds,IMC)层组成,合金骨架、α-Al颗粒和棒状η-Zn相在Sn-Zn共晶基体中任意排布。随钎焊温度的升高及超声振动时间的延长,接头内冶金反应相逐渐增加,钎缝组织更加均匀致密,α-Al颗粒数量显著增多,弥散强化作用显著。剪切测试结果表明,随温度的升高及钎焊时间的延长,蓝宝石/Al接头剪切强度逐渐提高,300℃超声钎焊90 s所得接头剪切强度最高,可达61.49 MPa。

To realize the low temperature joining of sapphire and Al alloy,Ni-10wt%Cu alloy foam reinforced Sn-9wt%Zn composite solder was used toultrasonically braze sapphire/Al dissimilar materials,and the effects of soldering temperature and ultrasonic vibration time on the metallurgic reaction behavior and mechanical properties of joints were investigated.The results show that the seam of sapphire/Ni Cu-Sn9Zn/Al joints was composed of Sn-based solder,rod-shapedη-Zn phase,α-Al particles,alloy skeletons and the Al3Ni intermetallic compound(Intermetallic compounds,IMC)layer formed on the surface of alloy skeletons.Alloy skeletons,rod-shapedη-Zn phase andα-Al particles were randomly distributed in Sn-Zn eutectic matrix.With the increase of soldering temperature and ultrasonic vibration time,the metallurgical reaction in the joints became more violent and the microstructure of joints were uniform and compact.The number ofα-Al particles increased significantly,which had a significant dispersion strengthening effect.The shearing test results show that the shear strength of sapphire/Al joints improved with soldering temperature and time increasing.The joints ultrasonically soldered at 300℃for 90 s exhibited the highest shear strength of 61.49 MPa.