电子设备热设计中高效导热垫的选型方法

A Selection Method of High-efficiency Thermal Pad in Thermal Design of Electronic Equipment

文中针对电子设备热设计中高效导热垫选型缺乏理论计算的现状,提出了基于导热垫厚度和导热系数计算的导热垫选型方法。该方法以热源与散热板的间隙尺寸链为基础,通过尺寸链公差和导热垫压缩量的关系,推导出导热垫厚度计算方法;通过自然对流散热理论,计算散热板的温度,再以单层平壁导热理论给出的导热系数与温差公式为基础,提出导热系数的计算方法,进而确定导热垫的型号。最后用实例详细介绍了电子设备热设计中导热垫的选型方法,并通过仿真验证了该方法的合理性。

Aiming at lack of theoretical calculation of high-efficiency thermal pad type selection in thermal design of electronic equipment,the selection method of the high-efficiency thermal pad type is put forward based on high-efficiency thermal pad thickness and thermal conductivity coefficient calculation.The calculation method of high-efficiency thermal pad thickness is deduced by the relation of dimension chain tolerance and high-efficiency thermal pad compression based on the gap dimension chain between the heat source and cool blocks.The cool pad temperature is calculated based on the natural convection cooling theory and the calculation method of thermal conductivity coefficient of high-efficiency thermal pad is put forward based on the thermal conductivity coefficient and temperature difference calculation formula from the single flat thermal conductivity theory.Then the high-efficiency thermal pad type is confirmed.At last,the selection method of the high-efficiency thermal pad type is explained in detail by example and its rationality is proved by analysis and experiment.