提高共晶焊接冷却效率的研究

Research on Improving Cooling Efficiency of Eutectic Welding

共晶焊接质量对芯片的可靠性和寿命影响很大,对共晶焊接工艺而言,冷却降温快慢对晶粒细化和焊接质量提升、生产效率提升至关重要。本文针对现有设备气冷的冷却速率慢的问题,提出并设计一套新型水冷降温系统。在现有设备上进行改造,在水冷模式条件下,对锡铅焊料焊接进行了实验和验证,并利用仪器对实验件进行检测分析。通过实验对比得出以下结论:采用水冷模式后的设备,其冷却速率比气冷模式的冷却速率明显提高,焊接的产品具有空洞率低和细化的晶粒结构等特点。

The quality of eutectic welding has a great influence on the reliability and life of the chips,and for the eutectic welding process,the speed of cooling is critical to the grain refinement,the improvement of welding quality and production efficiency.Aiming at the problem of the slow cooling rate of air cooling in existing equipment,this paper proposes and designs a new water cooling system.Through the modification on the existing equipment,the tin lead solder welding was tested and verified under the condition of water cooling mode,and the test pieces were tested and analyzed with the instrument.Through the comparison of the experimental results,it is concluded that the cooling rate of the equipment with water cooling mode is significantly higher than that with air cooling mode,and the welding products have the characteristics of low cavity rate and refined grain structure.