摘要
以硼质量分数为0.5%的Cu–B合金为金属基体以及平均粒径为500μm的金刚石颗粒为增强体,采用气压熔渗法制备金刚石/Cu–B合金复合材料,研究气压参数对其组织结构和热物理性能的影响规律。结果表明:随着气压升高,金刚石与Cu–B合金之间的界面结合效果、导热性能均增强,热膨胀系数减小;当气压为10 MPa时,其界面结合效果最优,界面处生成的碳化物层将金刚石完全覆盖,且100℃时的样品热导率为680.3 W/(m·K),热膨胀系数为5.038×10-6K-1,满足电子封装材料的热膨胀系数要求。
The Cu–B alloy with boron mass fraction of 0.5% was used as the metal matrix, and the diamond with an average particle size of 500 μm was used as reinforcement, the diamond/Cu–B alloy composites were prepared by gas pressure infiltration method. The effects of gas pressure parameters on the microstructures and the thermophysical properties of the composites were studied. The results show that the interfacial bonding effect and the thermal conductivity between diamond and Cu–B alloy are enhanced and the thermal expansion coefficient is reduced with the increase of gas pressure. When the gas pressure is 10 MPa, the interfacial bonding effect is the best. The carbide layer formed at the interface completely covers the diamond, the thermal conductivity of the sample at 100 ℃ is 680.3 W/(m·K), and the thermal expansion coefficient is 5.038×10-6K-1, which meets the thermal expansion coefficient requirements of electronic packaging materials.
作者
康翱龙
康惠元
焦增凯
王熹
周科朝
马莉
邓泽军
王一佳
余志明
魏秋平
KANG Aolong;KANG Huiyuan;JIAO Zengkai;WANG Xi;ZHOU Kechao;MA Li;DENG Zejun;WANG Yijia;YU Zhiming;WEI Qiuping(School of Materials Science and Engineering,Central South University,Changsha 410083,China;State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China;Center for Advanced Studies,Central South University,Changsha 410083,China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2022年第6期667-675,共9页
Diamond & Abrasives Engineering
基金
国家十四五重点研究发展计划(2021YFB3701800)
国家自然科学基金(52071345,51874370,51601226)
广东省十三五重点研究开发项目(2020B01085001)
湖南省高新技术产业科技创新引领计划(2022GK4037,2022GK4047)。
关键词
热导率
气压熔渗法
金刚石/Cu–B复合材料
热膨胀系数
thermal conductivity
gas pressure infiltration method(GPI)
diamond/Cu–B composite material
thermal expansion coefficient