金属基热界面材料研究进展

Research Progress of Metal Thermal Interface Materials

随着芯片向小型化、集成化和高功率化发展,其在工作时产生的热量增多,若产生的热量不能及时传递到外部,会严重影响电子元件的性能和使用寿命。热界面材料是电子元件散热结构中重要的组成部分,其主要作用是填充电子元件与散热器之间的空气间隙,使电子元件产生的热量快速转移,降低界面热阻。综述了现有热界面材料的种类和特点,详细介绍了金属基热界面材料的类型与性能特征、研究现状及存在的问题等,并对低熔点金属基热界面材料的发展进行了展望。

Thermal management of electronic circuits becomes a fundamental problem due to the chip miniaturization,integration and high power.If the heat generated by the electronic circuits does not transfer to the outside in time,the temperature of the components will be increased significantly.Meanwhile,the properties of the components will be decreased and the life of that will be reduced.Interface materials are important in the heat dissipation structure of electronic components.Their main function is to fill the air gap between the electronic components and the heat sink,so that the heat generated by the electronic components is quickly transferred and the interface thermal resistance is reduced.In this paper,the types and characteristics of thermal interface materials are summarized.Especially,the metal-based thermal interface materials,the classification and properties of the materials are detailed.Finally,the development of metal-based thermal interface materials is prospected.