双界面法在多电源集成电路热阻测试中的应用

The Application of Dual Interface Test Method In Junction-To-Case Thermal Resistance Measurement of Multi-Power Integrated Circuit

在依据JESD51-14中描述的一种基于瞬态结温测试的结到壳热阻双界面测试方法对多电源集成电路进行结壳热阻测试的过程中,选择不同的加热单元,所得的测试结果会出现不一致的情况。对同一款电路,通过对比和分析选择不同加热单元时结壳热阻测试的结果,得出:对多电源集成电路进行结壳热阻测试时,加热单元和测试单元应选取两种不同的电源,且加热单元尽量是电路中所占芯片面积最大的电源。如果选取一组电源作为加热单元,不能保证足够的发热面积,可以选取多组电源做为加热单元,以获得更为准确的测试结果。

During the measurement of junction-to-case thermal resistance based on the JESD51-14 transient dual interface test measurement of the thermal resistance junction to case of semiconductor devices with heat flow through a single path, selecting different heating unit and test unit, the results are not with one accord. By using the same multi-power integrated circuit and selecting the different heating unit, it is found that heating unit and test unit should be the different powers and the heating unit should cover area as large as possible in the integrated circuit in order to get an accurate result. If one heating unit doesn’t cover the enough area, two or more powers can be selected.