MSA体系中电流密度与镀液温度对镀锡层组织结构的影响

Study on Effect of Current Density and Plating Solution Temperature of MSA System on Organization Structure of Tin Coating

针对电镀工艺参数对电镀锡层性能的影响进行试验,采取电流效率、扫描电镜(SEM)、XRD等方法研究了电镀工艺参数中的电流密度与镀液温度对一种以间苯二甲醛为光亮剂的甲磺酸镀锡液的镀层影响,为寻找甲磺酸体系镀锡液的最佳电镀参数提供实验依据。结果表明,电镀液的电流效率随电流密度的增加而先增后减,镀层都以(220)晶面为最强峰;该体系可适应较宽的温度窗口而保持高电流效率,温度过高后,镀层形貌会发生显著改变。

For study the effect of electroplating process parameters on performance of electroplated tin layer,a test was carried out by using current efficiency, scanning electron microscope, XRD and the other methods, the study on effect of current density and plating solution temperature on methanesulfonic acid tin plating solution coating that taking isophthalaldehyde as brightener was carried out by above mentioned methods, it is provided the experimental basis to the best electroplating parameters of methanesulfonic acid system tin plating solution. Results show: the current efficiency of electroplating solution was increased at first then decreased along with the increasing of current density,(220) crystal face is the strongest peak of coating;the system is suitable for wider temperature window,and it can keep higher current efficiency, the morphology of coating will changed obviously after temperature is too high.