一种高速基材钻孔孔壁粗糙度改善研究

Research on the hole roughness improvement of a high-speed material drilling

随着5G市场的兴起,印制电路板朝着高传输速度、低介质损耗方向发展。为了满足材料的低介电常数和低介电损耗指标,往往会通过填充陶瓷粉等绝缘材料来实现,这就导致板材的加工难度增加,其中钻孔易出现孔粗超标等现象。本文通过工艺试验,对比不同的加工参数(转速、进刀速、孔限)及加工方法(盖板方式、钻孔后处理方式),找出改善孔粗的最优方案。

With the rise of 5G market, the Printed Circuit Board in the direction of high transmission speed, low medium loss development, the board also requires low Dk and low Df. To achieve low dielectric constant and low dielectric loss of the material, it is often achieved by filling other insulating materials, which leads to the difficulty of board processing,among which the roughness of the hole wall is the most prominent. By designing the test scheme, this paper compares different processing parameters(speed feed hit count) and processing methods(Cover Printed-Circuit Board way Postdrilling treatment method), and finds out the method to improve the roughness of the hole wall.