多层印制电路板压合参数对板厚均匀性的影响研究

Study on the influence of iamination parameters on the thickness uniformity of multilayer PCB

多层印制电路板板厚均匀性影响后制程的背钻深度和阻抗控制,进而影响PCB成品的高速信号传输。文章分析了层压板厚均匀性的影响因素,测试了缓冲材料和压合参数对板厚均匀性的影响。研究结果表明,优化缓冲材料、调整压合参数,均可以改善多层印制电路板板厚均匀性。

The problem of thickness uniformity of multi-layer printed circuit board has become increasingly prominent. The thickness uniformity of the laminate affects the back-drilling stub and impedance control, which in turn affects the high-speed signal transmission of PCB. In this paper, the influencing factors of the thickness uniformity of the laminate are analyzed, and the effects of buffer material and the pressing parameters on the thickness uniformity of the laminate are tested. The research results show that optimizing buffer material and adjusting pressing parameters can improve the thickness uniformity of the multilayer printed circuit board.