厚铜印制板镀金工艺导线蚀刻后的凹槽填充研究

Study on the filling of the groove after the etching of the process wire on thick copper PB with gold plating

文章主要阐述一种具有厚铜和镀金插头双面板,由外置工艺导线蚀刻后产生方形凹槽,需要采用绝缘油墨填充在凹槽内。对此凹槽填充工艺进行了研究验证,在不增加原有工艺流程及成本的基础上,探索并导入一种凹槽印刷新工艺流程,以满足客户对外观之要求。

This paper mainly describes a kind of double-sided board with thick copper and edge board contact.The square groove is formed after the external process wire is etched. The groove needs to be filled with insulating ink.Thisgroove filling process is researched and verified. On the basis of not increasing the original process and cost, a new groove printing process is explored and introduced to meet the customer’s requirements for appearance.