摘要
SRv6全称为Segment Routing IPv6,是当下最为热门的Segment Routing和IPv6两种网络技术的结合体。由于SRv6本身报文相对较长,当报文封装的SID层数过多时,部分芯片处理能力受限将导致部分芯片出现SID信息封装不全的问题。因此,该文针对SRv6的转发平面进行设计,利用封装流程环回的方案,解决了SID层数过多时,报文封装信息不全的问题,通过实验明确在芯片的承受能力下该流程能封装的最大层数为10层。而在不修改SRv6封装流程的情况下,考虑对SRv6报文进行压缩处理,同样可解决由于报文封装信息过长而导致报文信息封装不全的问题,通过实验可知标准SID的长度可压缩为64 bit或32 bit。
SRv6,the name of segment routing IPv6,is the most popular combination of segment routing and IPv6 network technologies.Due to the relatively long message of SRv6 itself,when there are too many Sid layers encapsulated in the message,the processing capacity of some chips will be limited,which will lead to the problem of incomplete SID information encapsulation in some chips.Therefore,this paper designs the forwarding plane of SRv6,and uses the scheme of packaging process loopback to solve the problem of incomplete message packaging information when there are too many SID layers.Through experiments,it is clear that the maximum number of layers that this process can package is 10under the bearing capacity of the chip.Without modifying the SRv6 encapsulation process,considering the compression processing of SRv6 message,the problem of incomplete message confidence encapsulation caused by too long message encapsulation information can also be solved.The experiment shows that the standard SID can be compressed to 64 bit or 32 bit.
作者
杨秋航
YANG Qiuhang(Wuhan Research Institute of Posts and Telecommunications,Wuhan 430074,China)
出处
《电子设计工程》
2023年第2期48-52,58,共6页
Electronic Design Engineering
