外圆结构化阵列凹坑表面的拓扑磨削研究

Study on Topological Grinding the Structured Cylindrical Surface with Array Dimple Pattern

由于结构化凹坑表面具有减阻效果,因此为在外圆表面磨削出凹坑结构化表面,依据磨削运动学原理与拓扑学理论提出了外圆凹坑表面的拓扑磨削方法。为了实现这一方法,首先提取凹坑表面特征参数与特征向量,建立了砂轮与工件的拓扑空间,给出拓扑映射关系并设计阵列结构砂轮;然后根据砂轮与工件的相对运动关系建立磨粒簇单个磨粒磨削轨迹方程,依据轨迹方程对凹坑表面成型过程使用MATLAB进行仿真,获得砂轮与工件的相对转速和磨削深度对结构化表面的影响规律;最后进行磨削实验。结果表明,使用拓扑磨削方法,能够实现外圆阵列结构化凹坑表面的拓扑磨削,磨削出的表面为原表面的拓扑表面,拓扑属性不变但特征参数随磨削用量改变而改变。

The structured dimple surface has a reduction friction effect, so in order to grind the dimple surface of the on the cylindrical workpiece, the topological grinding method of the cylindrical dimple surface is proposed according to the principle of grinding kinematics and topology.Firstly, the feature parameters and feature vectors of the dimple surface are extracted, Establish a topological space between the grinding wheel and the workpiece, the topological mapping relationship is given, and the structured grinding wheel with array pattern is designed.According to the relative motion relationship between the grinding wheel and the workpiece, the grinding trajectory equation of the single abrasive particle of the abrasive grain cluster is established, and then the dimple surface molding process is simulated using MATLAB according to the trajectory equation, and the influence of the relative speed and grinding depth of the grinding wheel and the workpiece on the structured dimple surface is studied, and finally the grinding experiment is carried out.The results show that by using the topological grinding method, the grinding of the structured dimple surface can be realized, and the the ground surface of is the topological surface of the original surface, and the topological properties are unchanged but the feature parameters change with the change of grinding parameters.