微型断路器动触头高速连续局部镀银

High-speed continuous local silver plating on moving contact of miniature circuit breaker

针对微型断路器动触头的功能需求,开发出了一种高速连续局部镀厚银工艺来替代整体滚镀厚银。探讨了预处理工艺,以及镀液的游离氰化钾质量浓度、银离子质量浓度、温度、阴极电流密度等因素对镀层性能的影响。采用该工艺不仅可获得满足动触头功能要求的银镀层,而且节约了大量贵金属银。

A high-speed continuous local silver plating process was developed as a substitute for the barrel plating of the whole part with thick silver coating to meet the functional requirements of miniature circuit breaker. The effects of various factors i.e. pretreatment process, mass concentrations of free potassium cyanide and silver ions in plating bath, temperature,and cathodic current density on the properties of Ag coating were discussed. The process could not only produce silver coatings compliant with the functional requirements of moving contact, but also save plenty of precious silver.