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面向超高速采样数据传输的差分互连结构设计与优化

Design and Optimization of Differential Interconnection Structure for Ultra-high-speed Sampling Data Transmission
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摘要 针对超高速采样系统中的差分信号,进行了信号完整性的研究,在GHz域的高速数据传输网络中,过孔结构会影响信号传输的质量,随着频率的增加,基于阻抗匹配的传输线设计方法将难以改善信号完整性,为了解决这个问题,采用了一种基于分段传输线的差分互连结构,该结构利用传输线阻抗的不匹配来减小过孔带来的影响,在分段差分传输线的结构设计中选择粒子群算法求解参数组合量过大的问题,通过眼图评估信号的质量,实验结果表明分段差分传输线设计的方法提高了高速数据传输的性能,改善了信号完整性。 Aiming at the differential signal in ultra-high-speed sampling system, its signal integrity was studied.In the high-speed data transmission network in the GHz domain, the via hole structure can affect the quality of signal transmission.With the increase of frequency, the transmission line design method based on impedance matching is difficult to improve the signal integrity.In order to solve this problem, a differential interconnection structure based on segmented transmission line was used.The structure used the mismatch of transmission line impedance to reduce the influence of via hole.In structural design of segmented differential transmission line, particle swarm optimization algorithm was selected to solve the problem of over large parameter combination.The quality of the signal was evaluated by eye diagram.The experimental results show that the design method of segmented differential transmission line improves the performance of high-speed data transmission and the signal integrity.
作者 张紫文 林文涛 王琳 胡忞 易朋兴 ZHANG Zi-wen;LIN Wen-tao;WANG Lin;HU Min;YI Peng-xing(School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)
出处 《仪表技术与传感器》 CSCD 北大核心 2022年第12期84-88,95,共6页 Instrument Technique and Sensor
基金 国家重点研发计划项目(2018YFB2003303)。
关键词 信号完整性 差分互连结构 粒子群算法 眼图 signal integrity differential interconnection structure particle swarm algorithm eye diagram
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  • 1PAULIS F D,ORLANDI A.Signal integrity analysis ofsingle-ended and differential striplines in presence ofEBG planar structures. IEEE Microwave and Wire-less Components Letters . 2009
  • 2SHIUE G H,WU R B.Reduction in reflections andground bounce for signal line over slotted power planeusing differential coupled microstrip lines. IEEETransactions on Advanced Packaging . 2009
  • 3SUDO T,SASAKI H,MASUDA N,et al.Electromag-netic interference (EMI)of system-on-package (SOP). IEEE Transactions on Advanced Packaging . 2004
  • 4CHAN J,COHEN T,KIRK B,et al.Common modeeffects on multigigabit-per-second interconnects. Design Conference . 2009
  • 5ACIMOVIC P.Novel band-stop common mode filter forhigh speed digital data transmission. Design Confer-ence . 2007
  • 6SOCHOUX P,HSU M,BHOBE A,et al.EMI from ser-des differential pairs. Design Conference 2009 . 2009
  • 7KOLLIPARA R,CHIA B,OH D,et al.Impact of back-plane connector pin field on trace impedance and verticalfield crosstalk. Design Conference . 2007
  • 8R. R. Tummala.What Is It and Why? A New Microsystem-Integration Technology Paradigm- Moore’s Law for System Integration of Miniaturized Convergent Systems of the Next Decade. IEEE Transactions On Advanced Packaging . 2004
  • 9M. Swaminathan,K. Joungho,I. Novak,J. P. Libous."Power distribution networks for system-on-package: status and challenges,". IEEE Trans. Adv. Packag . 2004
  • 10T. K. Wang,C. Y. Hsieh,H. H. Chuanget al.Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression. IEEE Trans. Microw. Theory Tech. Aug . 2009

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