填充CuSnTi钎料的Al_(2)O_(3)/1Cr18Ni9Ti真空钎焊接头组织性能研究

Study on Microstructure and Properties of Al_(2)O_(3)/1Cr18Ni9Ti Vacuum Brazing Joint with CuSnTi Solder

为研究陶瓷与不锈钢焊接的组织性能,填充CuSnTi钎料对Al_(2)O_(3)与1Cr18Ni9Ti不锈钢开展真空钎焊研究,并探索了温度、保温时间和压力对接头组织性能的影响。结果表明,钎焊过程中,Ti元素向两边界面区域扩散,在Al2O3界面处形成TiFe化合物层,在不锈钢界面处形成TiFe_(2)化合物层。钎缝组织主要为Cu固溶体、Cu_(81)Sn_(22)共晶组织和块状TiFe相。因Al_(2)O_(3)与1Cr18Ni9Ti热膨胀系数差异而引起较大的焊接应力,所有接头均在Al_(2)O_(3)侧近界面区域形成裂纹,剪切试验中,断裂发生在该区域。940℃、30 min和5 MPa条件下所得接头具有最高的剪切强度,为99.79 MPa。

In order to study the microstructure and properties of ceramics and stainless steel welding joint,the vacuum brazing tests between Al_(2)O_(3)and 1Cr18Ni9Ti stainless steel filled with Cu Sn Ti solder were studied,and the effects of temperature,holding time and pressure on the microstructure and properties of the joint were explored.The results show that Ti diffuses to the interface areas at both sides,TiFe compound layer is formed at the interface of Al_(2)O_(3)and TiFe_(2)compound layer is formed at the interface of stainless steel during the brazing process.The brazing joint is mainly composed of Cu solid solution,eutectic structure of Cu81Sn22and bulk TiFe phase.Due to the large welding stress caused by the difference of thermal expansion coefficient between Al_(2)O_(3)and 1Cr18Ni9Ti,cracks are close to the interface region at the side of Al_(2)O_(3)in all joints,and all fractures occur at the position in shearing tests.The shear strength of the joint reaches the maximum value of 99.79MPa under the conditions of 940℃,30 min and 5 MPa.