某机载电子设备的热仿真及试验分析

Thermal Simulation and Test Analysis of an Airborne Electronic Equipment

为验证某机载电子设备热设计的合理性,对数模使用Flotherm软件进行了热仿真,得出发热器件在70℃下的模拟温度,之后将生产出的样机放进高温箱,进行了相关验证性高温试验。从热仿真和热测试的结果可以看出,器件的模拟温度和实测温度均低于最高工作结温,设备能正常工作,进一步验证了结构设计的合理性,即基板厚度取1.5 mm,散热片厚度为1 mm,高度为6 mm能满足发热器件的散热需求。通过对比,可以看出试验的结果与仿真分析结果吻合度较高,在高温环境中器件的实测温度比仿真的温度要低5℃左右,所以如果仿真出来温度在器件最高允许温度范围内,实际温度可以满足设计要求;其结果为同类型机载电子设备热设计,尤其是采用类比方法进行热设计时提供了较大的参考价值。

In order to verify the rationality of the thermal design of an airborne electronic equipment,Flotherm software was used for thermal simulation of the logarithmic model to obtain the simulated temperature of the heating device at 70℃,and then the produced prototype was put into the high temperature box for relevant confirmatory high temperature tests.From the results of thermal simulation and thermal test,it can be seen that the simulated temperature and measured temperature of the device are lower than the maximum working junction temperature,and the device can work normally,which further verifies the rationality of the structural design.The substrate thickness is 1.5 mm,the radiator thickness is 1 mm,and the height is 6 mm,which can meet the heat dissipation requirements of the heating device.Through comparison,it can be seen that the test results are in good agreement with the simulation analysis results.In the high temperature environment,the measured temperature of the device is about 5℃lower than the simulation temperature.Therefore,if the simulation temperature is within the maximum allowable temperature range of the device,the actual temperature can meet the design requirements.The results provide a great reference value for the thermal design of the same type of airborne electronic equipment,especially when the analogy method is used for thermal design.