摘要
发展高可靠的互连封装新型焊料已经成为电子封装领域的前沿研究内容之一.本文制备了包镍碳纳米管增强SAC305焊料,并开展了不同含量增强SAC305焊料的双悬臂梁试样I型断裂测试,得到了不同添加含量SAC305的载荷-位移曲线.基于柔度的梁方法理论(CBBM)计算了增强焊料的I型断裂韧度.研究结果表明,其Ⅰ型断裂韧度随着包镍碳纳米管质量分数的增加,表现出先升高后降低的趋势.没有添加包镍碳纳米管的SAC305焊料的Ⅰ型断裂韧度约为0.53 N/mm,添加0.05wt%包镍碳纳米管的增强焊料的I型断裂韧度最高,约为1.14 N/mm,相较于没有添加包镍碳纳米管的SAC305焊料断裂韧度提高了1.15倍,表现出更好的抵抗裂纹扩展的特性.
The requirement on the novel solder joint materials is one of the critical topic studied in electronics packaging.In this paper,nickel-coated carbon nanotubes added SAC305 were prepared by mechanical mixing method.The mode Ⅰ fracture test was carried out based on the fabricated DCB double cantilever specimen.Based on the test,the loaddisplacement curve of the specimen was obtained.The beam method theory based on compliance(CBBM)was used to extract the mode Ⅰ fracture toughness of the fabricated solder.The results show that the mode Ⅰ fracture toughness of the solder increases first and then decreases with the increase of the additive content.The mode Ⅰ fracture toughness of SAC305 solder without additive content was about 0.53 N/mm,and the solder with 0.05wt%content of additive shows the highest mode I fracture tnughness is about 1.14 N/mm.Compared with SAC305 solder without nickel-coated carbon nanotubes,the mode Ⅰ fracture toughness of the solder was increased by 1.15 times,which shows better crack propagation resistance.
作者
张谋
秦飞
代岩伟
ZHANG Mou;QIN Fei;DAI Yanwei(Institute of Electronics Packaging Technology and Reliability,Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China)
出处
《微电子学与计算机》
2023年第1期124-129,共6页
Microelectronics & Computer
基金
国家自然科学基金项目(12272012)。
