一种宇航微系统SiP计算机模块的分析及设计

Analysis and design of a SiP computer module for aerospace microsystem

针对航天器用元器件高密度、高性能、小型化的特点,设计了一种应用于卫星及空间站平台的宇航微系统SiP(System-in-Package)计算机模块.SiP模块设计需解决信号干扰、供电系统不稳定以及散热性能差等问题,所以本文在SiP模块的封装、布局、层叠、布线设计方面,分别通过使用高热导率封装材料、加强散热性的封装形式以及对芯片采用上下腔布局的方式增强系统的散热能力,并采用低串扰设计、低阻抗设计提升系统中信号和电源的稳定性.通过仿真校验,该模块在125℃的条件下,实际工作温度仅上升25.3℃;最复杂的信号线之间的串扰低至−37.57 dB;各电源域的直流压降、电流密度以及阻抗参数值均优于参考指标.

Aiming at the characteristics of high density,high performance and miniaturization of components used in spacecraft,a computer module of aerospace micro system SiP applied to satellite and space station platform is designed in this paper.The design of SiP module needs to solve the problems such as signal interference,unstable power supply system and poor heat dissipation performance.Therefore,in terms of packaging,layout,lamination and wiring design of SiP module,this paper enhances the heat dissipation capacity of the system by using high thermal conductivity packaging materials,enhancing heat dissipation packaging forms and adopting upper and lower cavity layout for chips,and adopts low crosstalk design Low impedance design improves the stability of signal and power supply in the system.Through simulation and verification,the actual working temperature of the module only increases by 25.3℃under the condition of 125℃;the crosstalk between the most complex signal lines is as low as−37.57 dB;the DC voltage drop,current density and impedance parameters of each power domain are better than the reference indexes.