基于电子器件冷却及污染物传输的一般模型研究

Research on general model based on cooling and pollutant transports of electronic device

通过数值模拟研究了基于电子元器件的方腔模型内的介质流动和热质输运,利用流函数、热函数和质函数探讨了含固体块阵列的封闭方腔内热量与气态污染物的输运模式,分析了热源和冷源的排布方式及若干控制参数对腔内流动结构、温度及污染物浓度分布和热质输运效率的影响。结果表明,在热浮升力主导的自然对流下,热源布置在左壁面上端、冷源布置在右壁面下端条件下的方腔具有相对较高的热输运能力;而在质浮升力主导下,与热源布置位置恰好相反的方腔的热输运能力更高。随着质浮升力的增强,热源和冷源排布方式对于物料输运能力的影响减小。

Flow of medium and heat and mass transfers in an enclosure based on electronic components are studied by numerical simulation in this paper. The heat and gas pollutants transfer modes in a closed enclosure containing a solid block array are discussed by using flow, heat and mass functions. The influencies of heat and cold sources arrangement and several control parameters on flow structure, temperature, pollutant concentration, heat and mass transport efficiencies are analyzed. The results show that under natural convection dominated by thermal buoyancy, the heat transfer capacity of the enclosure with heat source at the upper left wall and the cold source at the lower right wall is relatively higher, while the enclosure with the opposite arrangement has higher heat transport capacity when mass buoyancy is dominant. In addition, with the increase of mass buoyancy, the influence of heat source and cold source arrangement on mass transfer decreases.