光刻胶涂胶厚度均匀性影响因素探究

Study on Influencing Factors of Thickness Uniformity of Photoresist Coating

介绍了光刻胶涂胶过程中对涂胶厚度均匀性的影响因素及发生均匀性问题的成因。对光刻工艺和光刻胶进行概述,通过对光刻工艺和光刻胶的涂胶学习可发现随着光刻工艺的不断进步,对光刻胶涂胶胶厚均匀性要求也在不断地提升,在实际的生产过程中却经常会出现涂胶均匀性较差而无法满足工艺要求。重点针对光刻胶涂胶厚度均匀性影响因素进行探究,详细介绍了会对其产生影响的因素。通过有效地管控好这些影响因素能够确保涂胶厚度均匀性,提升曝光质量,从而推动光刻技术的发展。

The influencing factors and the causes of the uniformity problems in the process of photoresist coating are introduced in this paper. An overview of lithography process and photoresist,by means of lithography process and photoresist study,it is found that with the continuous progress of lithography process,the uniformity requirement of photoresist thickness is constantly improved,but in the actual production process often appear poor uniformity and can’t meet the process requirements. Focus on exploring the influencing factors of the adhesive thickness uniformity of the photoresist coating gel,and introduce which factors will affect it in detail. The uniformity of coating thickness could be ensured by controlling effectively these influencing factors,improving exposure quality,further promotes the development of lithography technology.