摘要
针对集成电路MGP模封装生产过程中,人工生产效率低下,劳动强度大,质量不稳定,安全系统低,招工难等问题,本文研究了一种在MGP模具内部对封装前上料框架进行视觉检测的装置,并应用于笔者公司研发的MGP智能芯片封装设备中。该设备已在长电科技等封装龙头企业中使用,实现了芯片封装全自动生产,解放了劳动力,大幅提高产品良品率。
Aiming at the problems of low manual production efficiency,high labor intensity,unstable quality,low-end security system and difficulty in recruiting workers in the production process of integral circuit MGP mold encapsulation,this paper researches a device for visual inspection of the pre-encapsulation loading frame inside the MGP mold.And it is applied to the MGP intelligent chip packaging equipment developed by the author’s company.The device has been used in leading packaging companies such as JCET Group.It has realized the fully automatic production of chip packaging,liberated workforce and significantly improved the product yield rate.
作者
孙征
Sun Zheng(Wuxi G-chip Semiconductor Technology Co.,Ltd.,Wuxi Jiangsu 214174)
出处
《中国仪器仪表》
2022年第10期85-88,共4页
China Instrumentation
关键词
半导体
MGP模
视觉检测
上料框架
Semiconductor
MGP module
Visual inspection
Loading frame