全有机聚酰亚胺复合电介质薄膜储能特性的研究进展

Research progress on energy storage properties of all-organic polyimide composite dielectric films

聚酰亚胺(PI)因其优异的性能在新型高温储能电介质材料领域得到广泛关注。与无机/PI复合电介质材料相比,全有机PI复合电介质材料可以在获得高介电常数和高储能密度的同时保持优异的力学性能。本文首先讨论了影响聚合物电介质材料储能特性的关键参数,包括介电常数、介质损耗、击穿场强、储能密度、充放电效率和耐热性,然后分别从物理共混和化学共混两个角度分类介绍了影响全有机PI复合电介质材料储能特性的关键因素及发展动态,最后,对如何有效提升全有机PI复合电介质材料的高温储能特性问题进行了总结,并对其未来发展方向进行了展望。

Polyimide(PI) has attracted wide attention in the field of new high-temperature energy storage dielectric materials because of its excellent properties. Compared with inorganic/PI composite dielectric materials, all-organic PI composite dielectric materials can maintain excellent mechanical properties while obtaining high dielectric permittivity and high energy storage density. This paper firstly discussed the key parameters affecting the energy storage characteristics of polymer dielectric materials, including dielectric permittivity, dielectric loss, breakdown field strength, energy storage density, charge/discharge efficiency, and heat resistance. And then introduced the key factors and development trends affecting the energy storage characteristics of all-organic PI composite dielectric materials from physical blending and chemical blending, respectively. Finally, the problem of how to effectively improve the high-temperature energy storage characteristics of all-organic PI composite dielectric materials was summarized and the future development direction was proposed.