微米氧化铝填料对环氧树脂高温介电松弛行为的影响

Effect of micro-alumina filler on dielectric relaxation behavior of epoxy resin at high temperature

制备了填料质量分数分别为0、20%、40%的环氧微米氧化铝复合材料,通过常温及高温的介电试验,对高温介电谱进行拟合计算,分析微米氧化铝填料对环氧树脂高温介电松弛行为的影响。结果表明:与常温相比,微米氧化铝对环氧树脂高温介电松弛影响尤为显著。微米氧化铝填料增加了环氧树脂高温下的光频介电常数,而基本不影响松弛过程α的松弛强度。随着填料质量分数的提升,松弛过程α的松弛时间减小。此外,微米氧化铝填料的少量加入使得高温下松弛过程δ的松弛强度大幅度提升。但随着填料质量分数的提升,松驰过程δ的松弛强度反而下降,松弛时间不断提升。

Epoxy resin micro-alumina composite materials with micro-alumina mass fraction of 0, 20%, and 40% were prepared. The effect of micro-alumina filler on the dielectric relaxion behavior of epoxy resin at high temperature was analyzed by dielectric test at room temperature and high temperature and fitting calculation of high temperature dielectric spectra. The results show that the effect of micro-alumina on the dielectric relaxion at high temperature is more obviously than that at room temperature. With the introduction of alumina, the optical frequency dielectric constant increases, while the relaxation strength of relaxion process α shows little change. With the increase of mass fraction of filler, the relaxion time of relaxion process α decreases. Besides, the micro-alumina filler significantly increases the relaxion strength of relaxation process δ. However, with the increase of mass fraction of micro-alumina, the relaxation strength of relaxation process δdecreases, while the relaxation time increases continuously.