基于超声C扫描数字图像处理的缺陷面积分析

Defect area analysis based on ultrasonic C-scan digital image processing

以超塑成形扩散连接和复合材料制件为研究对象,发展一种基于超声C扫描数字图像处理的缺陷面积分析方法,并开发相应的GUI(图形用户界面)。利用该GUI对典型超塑成形扩散连接和复合材料试件超声C扫描图像进行分析处理,结果表明,所提方法可对有无结构特征试件进行缺陷面积分析,以及试件完好率的计算,具有准确度高、操作灵活和广泛适用等优点,为缺陷图像面积的超声C扫描分析提供了一种有效的解决途径。

In this paper, for superplastic forming diffusion bonding and composite parts, a defect area analysis method based on ultrasonic C-scan digital image processing is developed, and the corresponding GUI interface is developed. The GUI was used to analyze and process the ultrasonic C-scan images of typical superplastic forming diffusion joints and composite test pieces. The results show that the proposed method can analyze the defect area in test pieces with or without structural features, and calculate the intact rate. The proposed method has the characteristics of high accuracy, flexible operation and certain universality. The research work provides an effective solution for defect area analysis in ultrasonic C-scan images.