摘要
传统的Cu-Al_(2)O_(3)制备方法存在工艺复杂、难以兼顾大尺寸和颗粒弥散等缺点。利用真空固态愈合法将Cu-Al_(2)O_(3)小尺寸复合材料构筑成形,讨论愈合参数对界面组织及性能的影响。结果表明,愈合温度为970℃,保温时间为120 min,压力为30 MPa时,愈合效果最佳。复合材料愈合界面的抗拉强度为470 MPa,达到原始材料的96.7%。愈合温度的升高使材料满足了动态再结晶的动力学和热力学条件,晶粒间不均匀的Al_(2)O_(3)颗粒引入较高的热变形储能,在Al_(2)O_(3)颗粒附近聚积位错形核。热压愈合有效消除了原始界面缺陷,伴随着大规模的界面迁移、动态再结晶及晶粒长大的过程。
Conventional fabrication of Cu-Al_(2)O_(3)is difficult to balance large size and particle dispersed distributionwith complex technological process. Herein, Cu-Al_(2)O_(3)composite was constructed and formed by hot compression bonding(HCB), and effects of parameters on the interfacial microstructure and properties of the composites were investigated. The results indicate that optimal bonding is achieved at 970 ℃ for 120 min and 30 MPa. The bonding tensile strength of the composites is 470 MPa, reaching 96.7% of the original material. The increase of bonding temperature meets the dynamic and thermodynamic conditions of dynamic recrystallization, where the heterogeneous Al_(2)O_(3)particles between grains introduce a higher thermal deformation energy storage, leading to the aggregated dislocation and nucleation near the interface. HCP effectively eliminates the initial interfacial defects, accompanied by large-scale interfacial migration, dynamic recrystallization, and grain growth.
作者
张宇博
高鹏飞
刘嘉鸣
丁程浩
申玉婷
李廷举
Zhang Yubo;Gao Pengfei;Liu Jiaming;Ding Chenghao;Shen Yuting;Li Tingju(School of Materials Science and Engineering,Dalian University of Technology;Key Laboratory of Solidification Control and Digital Preparation Technology(Liaoning Province);Ningbo Institute of Dalian University of Technology)
出处
《特种铸造及有色合金》
CAS
北大核心
2023年第1期1-6,共6页
Special Casting & Nonferrous Alloys
基金
国家重点研发计划资助项目(2018YFA0702900)
国家自然科学基金资助项目(52171135)。
