摘要
片式厚膜电阻在电子产品中的应用非常广泛,但是传统的厚膜电阻的电极中含银,在运行环境比较恶劣,含硫污染物较多的情况下,银非常容易同硫发生反应,生成电导率低的硫化银,从而使电阻的阻值变大甚至开路。开展了多种电阻工艺方案、工艺材料的耐硫化环境试验。通过对比,提出了片式厚膜电阻防硫化的可靠性技术解决方案。
Chip thick film resistors are widely used in electronic products, but the electrodes of traditional thick film resistors contain silver. In the case of poor operating environment and many sulfur pollutants, silver is very easy to react with sulfur to generate silver sulfide with low conductivity, which makes the resistance value of electrical resistance larger or even open circuit. Various resistance process plans and process materials have been tested for resistance to vulcanization. Through comparison, a reliable technical solution for the sulfide corrosion protection of chip thick film resistor is proposed.
作者
陈吉
陈鹏
陈祎
周峰
潘祥虎
CHEN Ji;CHEN Peng;CHEN Yi;ZHOU Feng;PAN Xianghu(Zhuzhou CRRC Times Electric Co.,Ltd.,Zhuzhou 412000,China)
出处
《电子工艺技术》
2023年第1期33-36,52,共5页
Electronics Process Technology
关键词
厚膜电阻
敷形涂覆
硫化
thick film resistor
conformal coating
sulfuration