基于焊接数据分析的平行缝焊缺陷检测方法

Parallel Seam Welding Defect Detection Based on Welding Data Analysis

平行缝焊是一种用于对露点和气密性要求较高的微电子单片集成电路管壳进行气密性封装的封装工艺。影响缝焊质量的因素有很多,因此有多种针对平行缝焊缺陷检测的手段,通常是经过显微镜目检,氦质谱检漏和氟油粗检三种检测方式。通过对不同焊接问题反馈的焊接数据进行数据分析,提出一种基于焊接数据分析的平行缝焊缺陷检测,可以有效提高缺陷检测的准确率和效率。

Parallel seam welding is a kind of packaging process for hermetic packaging of microelectronic monolithic integrated circuit shell with high requirements for dew point and air tightness. There are many factors that affect the quality of seam welding, so there are a variety of methods to detect the defects of parallel seam welding, usually through visual inspection by microscope, helium mass spectrometry leak detection and fluorine oil inspection. Based on the analysis of welding data from different welding problems,a parallel seam welding defect detection method based on welding data analysis is proposed, which can effectively improve the accuracy and efficiency of defect detection.