添加中间层对超声波焊接头界面及导电性能影响研究

Study on the Effect of Adding Intermediate Layer on Interface and Electrical Conductivity of Ultrasonic Welding Joints

研究了1060铝合金和T2紫铜添加中间夹层的超声波焊接。分析超声波焊接过程,得知平行振动方向的材料塑性流动强于垂直振动方向,且原子的扩散距离约是垂直方向的2倍。同种焊接参数条件下分别添加12μm厚的银箔、10~20μm颗粒大小银粉、铁粉、石墨粉为接头的中间夹层,通过EDS、SEM方法分析界面的塑性流动和元素扩散情况。添加银箔的接头电阻值约55μΩ,明显大于其他中间层的接头。

This paper studies the ultrasonic welding of 1060 aluminum alloy and T2 copper with an intermediate interlayer.Analyzing the ultrasonic welding process,it is found that the plastic flow of the material in the parallel vibration direction is stronger than the vertical vibration direction,and the diffusion distance of atoms is about twice that of the vertical direction.Under the same welding parameters,12μm thick silver foil,10~20μm particle size silver powder,iron powder,and graphite powder were added as the intermediate interlayer of the joint.The plastic flow and element diffusion of the interface were analyzed by EDS and SEM methods.The resistance value of the joint with silver foil is about 55μΩ,which is significantly higher than that of the joints with other intermediate lay.