挠性印制板基板自然对流换热仿真研究

Simulation of natural convection on flexible PCB substrate

随着挠性印制电路板(FPCB)在电子设备中的应用越来越广泛,对FPCB的热可靠性要求也越来越严格。本文采用Fluent软件对FPCB的自然对流换热过程进行热电流耦合仿真分析,得到FPCB在自然对流换热过程中的流场、温度场及换热过程相关数据;通过与实测比对,研究不同电流(1~15 A)和铜线宽度(15~30 mm)对仿真的影响,以验证仿真方法的准确性,结果表明,所采用的热仿真方法对FPCB热分析工有效。

The requirements for thermal reliability of Flexible Printed Circuit Board(FPCB) are becoming more and more demanding with the increasing application of FPCB in electronic devices. In this paper, the Fluent software was used for thermal-electric coupling simulation of natural convection on FPCB, and flow field, temperature field and heat transfer coefficient were obtained. The influences of different current(1~15 A) and copper width(15~30 mm) on heat transfer were studied and compared. The simulation results were validated against test results, which indicates that simulation can be of great significance in the thermal analysis of FPCB design.