软硬结合板孔周边聚酰亚胺撕裂改善研究

The improvement of PI material tearing around the hole in R-FPCB

软硬结合板孔周边聚酰亚胺(PI)撕裂为偶发的不良现象,业内一般通过调整钻孔参数进行改善,但这种调整会增加生产成本,且改善效果不明显。为彻底解决这一问题,本文通过试验对比不同钻孔参数和软板材料。结果表明:PI撕裂不良的根本原因是软板材料的抗撕裂强度低,使用不同钻刀和提高转速均无法改善,替换抗撕裂强度更大的软板材料制作可完全解决问题。研究结果以期为业界制作高可靠性的软硬结合板产品提供依据,为认证软板材料提供借鉴。

PI tearing around the hole is an occasional adverse phenomenon in R-FPCB, which is generally improved by adjusting parameters in the industry. However, such adjustment takes increasing production cost as the cost, and the improvement effect is not obvious. In order to completely solve this problem, through the test comparison of different drilling parameters and different PI, it is concluded that PI root with poor tearing with low tearing strength,which can not be improved by using different drilling tools and increasing the rotate speed. This finding provides the basis for the manufacture of high reliability R-FPCB, also provides a reference method for the certification of FPCB.