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可降解松节油基高分子材料的制备及性能研究 被引量:1

Preparation and Performance Study of Degradable Turpentine-based Polymer Materials
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摘要 以环氧大豆油(ESO)、N,N’-(二呋喃基)-1,8-对䓝烷二胺(FMDA)、6-马来酰亚胺己酸(MA)和己二酸为原料,合成了一种含有酯键和D-A键的生物基材料(FMDA-ESO)。通过傅里叶变换红外光谱(FT-IR)、差示扫描量热(DSC)、热重(TG)、万能试验测试机等测试方法对材料进行表征及测试。实验结果表明:酯键及D-A键的存在使FMDA-ESO材料形成了交联结构,FMDA的刚性结构可提高所得材料的力学性能。随着FMDA-ESO固化配方中FMDA含量增加,材料的热稳定性增加。在乙醇胺的作用下,可实现材料FMDA-ESO快速降解,可在135℃,30 min下降解为数均相对分子质量为2691的低聚物。 A bio-based polymer material FMDA-ESO containing ester and D-A bonds was synthesized from epoxidized soybean oil(ESO),N,N′-(difuranyl)-1,8-p-menthane diamine(FMDA),maleimidic caproic acid and adipic acid.The materials were characterized and tested by Fourier transform infrared spectroscopy(FT-IR),differential scanning calorimetry(DSC),thermogravimetric analysis(TG)and universal test tester.The results showed that the cross-linked structure was formed in FMDA-ESO with the presence of ester and D-A bonds,and the rigid structure of FMDA could improve the mechanical properties of the obtained materials.With the amount increasement of FMDA in the FMDA-ESO cured formulation,the thermal stability of the material increased.Rapid degradation of FMDA-ESO could be achieved in the presence of ethanolamine,which could be degraded to oligomers with a number-average molecular weight of 2691 at 135℃for 30 min.
作者 代松林 徐亚洲 马慧茹 张海波 赵振东 陈玉湘 DAI Songlin;XU Yazhou;MA Huiru;ZHANG Haibo;ZHAO Zhendong;CHEN Yuxiang(Institute of Chemical Industry of Forest Products,CAF,Key Lab.of Biomass Energy and Material,Jiangsu Province,Key Lab.of Chemical Engineering of Forest Products,National Forestry and Grassland Administration,National Engineering Research Center of Low-Carbon Processing and Utilization of Forest Biomass,Nanjing 210042,China;Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources,Najing Forestry University,Nanjing 210037,China)
出处 《林产化学与工业》 CAS CSCD 北大核心 2023年第1期57-62,共6页 Chemistry and Industry of Forest Products
基金 国家自然科学基金资助项目(31870557)。
关键词 䓝烷二胺 生物基 动态键 热降解 menthane diamine bio-based dynamic bond thermal degradation
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