摘要
采用有限元分析软件,以小尺寸陶瓷四边引线扁平封装(CQFP)结构为研究对象,对其在温度循环试验中应力应变分布进行了仿真分析。分析了引线成型角度和成型次数两种参数对焊点的影响,进而对CQFP结构在温度循环载荷作用下的疲劳寿命进行了计算。结果表明,对引线进行二次成型或者减小引线成型角度可以提高焊点的热疲劳寿命。
Taking the small size CQFP structure as the research object,its stress-strain distribution is simulated and analyzed in the temperature cycle test by using finite element analysis software.The influence of the lead forming angle and forming times on the solder point is analyzed,and the fatigue life of the CQFP structure under the temperature cycle load is calculated.The results show that the thermal fatigue life of solder joint can be improved by secondary forming or reducing the forming angle of the lead.
作者
樊荣
杨振涛
FAN Rong;YANG Zhentao(China Electronics Technology Group Corporation No.13 Research Institute,Shijiazhuang 050051,China)
出处
《电子质量》
2022年第11期21-26,共6页
Electronics Quality
