摘要
基于有限元分析理论,针对铜带缠绕型CCGA的加固工艺进行仿真,明确不同工艺参数对器件焊接残余应力的影响规律。以残余应力最小为准则,获取了加固工艺的优选参数组合。使用FP4526型填充胶,在靠近基板端底部灌封填充高度为0.622 mm的固化胶,在起始温度为25℃、升温速率为5℃/min、升温时长为25 min、固化温度为150℃、固化时间为120 min、降温速率为5℃/min的条件下加热,此时产生的最大残余应力是9.497 MPa。
Based on the finite element analysis theory, this thesis conducts simulation research on the reinforcement process of copper tape winding CCGA, and the influence law of different process parameters on welding residual stress of devices is clarified. Taking the minimum residual stress as the criterion, the preferred combination of parameters for the reinforcement process is obtained as follows: The curing adhesive with 0.622 mm thickness is filled close to the bottom of the substrate end by using FP4526 filling adhesive. The initial temperature is 25 ℃, the heating rate is 5 ℃/min, the heating time is 25 min, the curing temperature is150 ℃, the curing time is 120 min, and the cooling rate is 5 ℃/min. The maximum residual stress is 9.497 MPa.
作者
张国光
田文超
刘美君
从昀昊
陈思
王永坤
ZHANG Guoguang;TIAN Wenchao;LIU Meijun;CONG Yunhao;CHEN Si;WANG Yongkun(Foshan Blue Rocket Electronics Co.,Ltd.,Foshan 528051,China;School of Mechano-Electronic Engineering,Xidian University,Xi’an 710068,China;State Key Lab of Reliability Physics and ApplicationTechnology of Electronic Components,CEPREI,Guangzhou 511370,China)
出处
《电子与封装》
2023年第2期16-22,共7页
Electronics & Packaging
基金
中央高校基本科研业务费项目(QTZX2139)
西安电子科技大学教育教学改革研究项目(B21011)。
关键词
铜带缠绕型
陶瓷柱栅阵列
加固工艺
残余应力
copper tape winding type
ceramic column grid array
reinforcement process
residual stress
