小型化汽车防撞雷达封装天线

Miniaturized antenna in package for automotive anti-collision radar

基于汽车防撞雷达高精度、小型化和轻型化等要求,提出了一种应用于车载防撞雷达前端的新型片上天线设计。封装天线(AiP)技术为天线—芯片集成封装提供了一种解决方案,有助于减少设备尺寸,提高系统的封装密度。而天线的介质基板采用的硅基材料,可以实现小型化、高集成的AiP。借助于Ansoft-HFSS仿真软件进行建模与仿真,设计了此AiP,给出了其最佳参数与辐射性能,该天线的最佳尺寸为9000μm×5000μm×185μm。测量结果表明:AiP的中心频率为77.14 GHz,带宽为1.01 GHz,天线峰值增益为8.63 dBi,满足设计指标,可用于汽车防撞雷达片上防撞天线。

Based on the requirements of high precision,miniaturization and lightweight of automotive anti-collision radar,a new design of antenna in package applied to the front end of automotive anti-collision radar is proposed.Antenna in package(AiP)technology provides a solution for antenna-chip integrated packaging,which helps to reduce device size and improve system AiP.The silicon-based material used in the dielectric substrate of the antenna can realize the miniaturization and high integration of the AiP.With the help of Ansoft-HFSS simulation software for modeling and simulation,the AiP is designed,and its optimal parameters and radiation performance are given.The optimal size of the antenna is 9000μm×5000μm×185μm.The measurement results show that the center frequency of the AiP is 77.14 GHz,the bandwidth is 1.01 GHz,and the peak gain of the antenna is 8.63 dBi,which meets the design requirements and can be used in the automotive anti-collision radar on-chip anti-collision antenna.