局部高热流密度器件射流冲击冷板流动传热特性数值研究

Numerical Study on Flow and Heat Transfer Characteristics of Jet Impinging Cold Plate for Local High Heat Flux Device

为解决大功率雷达等设备中存在的局部高热流密度热管理难题,进行了大幅面、非均匀高热流密度散热技术研究,提出了一种可同时对上下两侧发热面进行冷却的嵌入式射流冲击冷板,开展了受限空间射流冲击冷却过程流动换热特性数值模拟,获得了嵌入式射流冲击冷板内部的流动换热特性,并对射流冲击距离、射流孔直径、冷板体积流量等参数对流动换热性能的影响规律进行了分析。结果表明,对尺寸为50 mm×72 mm、背景热流密度为1.2 W/cm^(2)、布置有8个3 mm×3.5 mm、125 W/cm^(2)高热流密度芯片的发热面,嵌入式射流冲击冷板的换热系数分布特点可满足局部高热流密度散热需求,且在射流冲击距离为3 mm、射流孔直径为2 mm时,综合考虑换热性能与压降后的冷板性能最佳,在冷板体积流量为5.5 L/min时,芯片最大温升为15.6℃,压降为3.917 kPa。所提嵌入式射流冲击冷板及研究结果可用于局部高热流密度器件热管理。

In order to solve the problem of local high heat flux thermal management in high-power radar and other equipment,research on large format and non-uniform high heat flux heat dissipation technology is carried out.With a newly proposed embedded jet impinging cold plate capable of simultaneous heat dissipation on both the upper and lower sides,numerical simulations of flow and heat transfer characteristics of the impinging cooling process are carried out in confined space.The heat transfer characteristics inside the embedded jet impinging cold plate are obtained and the effects of jet height,jet diameter and cold plate volume flow rate on heat dissipation performance are discussed.The results show that the heat transfer coefficient distribution characteristics of the embedded jet impinging cold plate meet the requirement for local high heat flux heat dissipation of a 50×72 mm^(2) heating surface with a background heat flux of 1.2 W/cm^(2) and arranged with eight 3×3.5 mm^(2),125 W/cm^(2) high heat flux chips.Considering the heat transfer performance and pressure drop,the cold plate gains its optimum performance at the jet height of 3 mm and diameter of 2 mm.At the cold pate volume flow rate of 5.5 L/min,the maximum temperature rise of the chip is 15.6℃,and the pressure drop is 3.917 kPa.The embedded jet impinging cold plate proposed in this paper and the research results are applicable to thermal management of non-uniform high heat flux devices.