化学镀Ni-P对挤压铸造固-液复合Cu/Al双合金界面的影响

Effects of Electroless Ni-P Plating on Squeeze Casting Solid-liquid Composite Cu/Al Double Alloy Interface

为了有效增强Cu/Al双合金界面结合效果,采用化学镀镍的方法在铜合金的表面镀厚为11μm的Ni-P层,然后采用挤压铸造工艺制备了Cu/Al双合金铸件。研究表明,与无化学镀相比,采用化学镀Ni-P层的Cu/Al双合金界面无裂缝、夹渣等缺陷,界面厚度均匀,为冶金结合。界面由3个区域组成,从铜基体一侧开始依次是:Ⅰ区域主要由Ni(Cu)固溶体组成、Ⅱ区域由Ni3P相组成、Ⅲ区域由Al_(3)Ni相组成;双合金界面的剪切强度显著增大,可达28.26 MPa。

In order to effectively enhance the interface bonding effect of Cu/Al double alloy, a 11 μm Ni-P layer was plated on the surface of the copper alloy by electroless nickel plating, and then the Cu/Al double alloy casting was prepared by squeeze casting process. Compared with electroless plating, the Cu/Al double alloy interface using electroless Ni-P layer has absence of defects such as cracks and slag inclusions, and the interface thickness presents uniform, resulting in a good metallurgical bonding interface. In addition, the interface layer consists of three regions from the copper matrix as follows: Ⅰ region mainly composed of Ni(Cu) solid solution;Ⅱ region composed of Ni3P phase, and Ⅲ region composed of Al_(3)Ni phase. The shear performance of the double alloy interface is significantly increased to 28.26 MPa.