低压成套开关设备的温升因素与测试分析

Analysis of Temperature Rise Factors and Test of Low-Voltage Switchgear

阐述低压成套开关在特定工作环境中的温升值测试方案,温升试验的影响因素,包括连接导线、不稳定的试验电流,探讨温升试验的展望。

This paper describes the temperature rise test scheme of low-voltage switchgear in a specific working environment, the influence factors of temperature rise test, including connecting wires,unstable test current, and discusses the prospect of temperature rise test.