响应面法分析SAC305焊球激光焊接参数对润湿角的影响

Response Surface Analysis of the Influence of Laser Jet Solder Ball Bonding Process Parameters on Wetting Angle of SAC305 Solder Balls

基于响应面法分析了激光植球焊接工艺参数对SAC305焊料润湿性的影响。设计单因素试验并进行植球焊接,分析激光功率、加热时间和氮气压强对焊点润湿角的影响规律。进一步设计响应面法试验,建立回归方程预测模型,并对焊接工艺参数进行优化。结果表明:随着激光功率、加热时间和氮气压强增大,焊点润湿角逐渐减小,三者对焊点润湿角影响大小排序为:激光功率>加热时间>氮气压强;直径600μm焊球的响应面法优化工艺参数为激光功率84.27%,加热时间0.064 s,氮气压强1089.48 Pa,焊点润湿角为31.032°,焊点润湿铺展良好。经实验验证,响应面法预测值与实测值相近,可为优化激光植球焊接工艺参数提供参考。

Based on the response surface method,the influence of laser jet solder ball bonding process parameters on the wettability of SAC305 solder was analyzed.Single factor experiment was designed and laser jet solder ball bonding was carried out to analyze the influence law of laser power,heating time and nitrogen pressure on the wetting angle of solder joints.Furthermore,the response surface method test was designed to establish the regression equation prediction model and optimize the bonding process parameters.The results show that the wetting angle of solder joints decreases with the increase of laser power,heating time and nitrogen pressure.The influencing order of the three factors on the wetting angle of solder joints is:laser power>heating time>nitrogen pressure.The optimized process parameters of response surface method for solder balls with a diameter of 600μm are laser power of 84.27%,heating time of 0.064 s,nitrogen pressure of 1089.48 Pa,solder joint wetting angle of 31.032°,and solder joints are well wetted and spread.The experimental results show that the predicted value of response surface method is close to the measured value,which can provide reference for optimizing process parameters for laser jet solder ball bonding.