摘要
通过涂布法并结合铜箔棕化处理技术进行液晶聚合物(LCP)覆铜板层压制作,获得LCP覆铜板,其厚度误差较好地控制在10%以内。对LCP覆铜板的综合应用性能,如热稳定性、尺寸稳定性、高频应用特性等进行综合表征。结果表明:LCP覆铜板的玻璃化温度(T_(g))达到了200℃;覆铜板经过如高温冲击、冷热冲击试验后,仍然具备较好的剥离强度和耐热性能;此外,高频D_(k)、D_(f)与插入损耗测试,证实了其在高频方面的应用优势,因此可成为挠性印制电路板领域重要的电子材料。
In this paper, the fabrication of LCP CCL was studied by coating method. Its application properties of LCP copper clad laminate such as thermal stability, dimensional stability and high frequency application characteristics were comprehensively characterized. Results suggested that LCP CCL has good thermal, mechanical and high-frequency application properties, and is an important electronic material in the field of flexible printed circuit boards in the future.
作者
朱永康
黄清华
周国云
王守绪
杨文君
Zhu Yongkang;HUANG Qinghua;ZHOU Guoyun;HE Wei;WANG Shouxu(Netron Soft-tech(Zhuhai)Co.Ltd.,Zhuhai 519040,Guangdong,China;School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,Sichuan,China;Jiangxi Electronic Circuit Research Center of UESTC,Pingxiang 337009,Jiangxi,China)
出处
《印制电路信息》
2023年第2期8-11,共4页
Printed Circuit Information
基金
珠海市科技计划项目(ZH22044702190033HJL)。
关键词
挠性电路板
液晶聚合物
覆铜板
高频特性
吸湿率
flexible circuit board
liquid crystal polymer(LCP)
copper clad laminate(CCL)
highfrequency characteristics
moisture absorption rate
