苯并噁嗪树脂在无卤低介电覆铜板中的应用

Study on the application of benzoxazine resin in halogenfree and low dielectric copper clad laminate

利用DSC测试仪、GT测试仪和从阻抗材料分析仪,从反应性、热学性和介电性能方面对覆铜板行业常见的3种苯并噁嗪树脂展开实验研究。结果表明:二氨基二苯甲烷苯并噁嗪(MDA-BOZ)的自聚反应起始温度为167.15℃,其反应活性最高;双酚A型苯并噁嗪树脂(BPA-BOZ)的反应活性最低且在固化物玻璃化转变温度和介电损耗方面的表现不如二胺型苯并噁嗪,并从分子结构层面分析了性能差异。在无卤低介电覆铜板配方中对3种苯并噁嗪树脂进行应用考察,评估了3种苯并噁嗪树脂在板材的剥离强度、热学性、热膨胀性和介电性能方面的表现。结果表明:在10%的添加量下,3种苯并噁嗪树脂可明显降低配方的介电损耗并提高玻璃化转变温度,BPA-BOZ体系的玻璃化转变温度仅为172.53℃,介电损耗为0.008 2,综合表现最差。该研究可为无卤低介电覆铜板开发提供参考。

Three kinds of benzoxazine resins commonly used in copper clad laminate(CCL) industry were studied from the reactivity, thermal and dielectric properties by DSC, GT tester and Impedance material analyzer. The results showed that MDA-BOZ showed the highest self-polymerization activity at the initial temperature of 167.15 ℃,while BPA-BOZ showed the lowest reactivity and lower performance than diamine benzoxazine in terms of Tgand dielectric loss, the difference in performance was analyzed from molecular structure. The application of three benzoxazine resins was investigated in the formulation of halogen-free and low dielectric CCLs, and the performance of the three benzoxazine resins in peel strength, thermal property, thermal expansion and dielectric properties of CCL was evaluated. The results showed that: At 10%, benzoxazine resins can significantly reduce the dielectric loss and increase Tgof the formulation. The Tgof BPA-BOZ system is only 172.53 ℃, and the Dfis 0.008 2, showing the worst comprehensive performance. The above research provides reference for the development of halogen-free low dielectric copper clad plate.