低热膨胀系数填料对钻孔加工的影响

Study on the influence of low coefficient of thermal expansion filler on drilling

在印制电路板(PCB)加工过程中,为满足高温下的高精度图形要求中,通常会添加一定量的低热膨胀系数(CTE)填料。低CTE填料一般为硅类材料,而硅类材料硬度较大,会加剧钻刀的磨损程度,影响钻孔加工孔限的设计,并增加加工成本。研究不同低CTE填料比例情况下的钻刀磨损程度,以及不同钻刀磨损下的钻孔精度和孔壁质量,得到低CTE填料的最佳钻孔加工孔限参数。

In PCB production materials, a certain amount of low thermal expansion coefficient filler is usually added. The filler with low coefficient of thermal expansion is generally silicon material, but the hardness of silicon material is relatively high, which will increase the wear degree of the drill tool, thus affecting the design of the drilling hole limit, which will lead to the problem of raising the processing cost. In this paper, by studying the wear degree of the drill tool and the drilling accuracy and hole wall quality of the low CTE material with different filler ratios, the optimal drilling hole limit parameters of the low CTE material are obtained.