印制板拼版大面积空旷区域层压铜箔起皱的改善

Improvement of laminated copper wrinkle in large open area of panel for printed board

在多层印制电路板层压工序中,容易出现压合后铜箔起皱的现象,导致产品报废。针对12μm薄铜箔在大面积空旷区域压合中,容易起皱这一质量问题展开原因分析,从调整半固化片参数、层压压合参数、拼板方式和铜箔厚度几个角度进行实验论证。通过实验结果得到最佳工艺调整路线,由此提升了印制板生产合格率。

In the laminating process of multilayer printed circuit boards, it is easy to wrinkle the copper foil after laminating, which will lead to the scrapping of products. The reason of the 12 micron thin copper foil was easy to wrinkle when pressing in a large open area is analyzed, and the experimental action is carried out from the aspects of adjusting the parameters of the semi solidified sheet, the laminated pressing parameters, the splicing method and the thickness of the copper foil in this paper. The best process adjustment route is obtained through the experimental results, so as to improve the production qualification rate of printed boards.