不同基材结构PCB散热性能研究

Research on heat dissipation performance of PCB with different substrate structure

为验证对不同基材结构的印制线路板导热能力,通过热仿真分析实际散热效果,分析研究得出不同基材结构印制线路板的导热能力,其嵌埋铜块或导热陶瓷结构线路板具备优良的导热能力。随着5G通讯的发展,电子产品对散热的功率需求越来越高,尤其需要满足产品芯片散热性能要求。主要是从材料选择、产品搭配设计、流程制作等多个方面进行对比验证,以期为后续指导该类产品提供技术支持与帮助。

Through thermal simulation and actual heat dissipation effect to verify the analysis and research of the thermal conductivity of printed circuit boards of different substrate structures, it is concluded that the thermal conductivity of printed circuit boards of different substrate structures, embedded copper block or thermal conductive ceramic structure circuit boards have excellent thermal conductivity.