Ce对Cu-0.4Mg-xCe合金组织和性能的影响

Effect of Ce on microstructure and properties of Cu-0.4Mg-xCe alloys

通过在Cu-Mg合金中添加Cu-Ce合金制备Cu-0.4Mg-xCe(x=0,0.1,0.2,0.3)合金。采用扫描电子显微镜(scanning electron microscope,SEM)、透射电子显微镜(transmission electron microscope,TEM)、维氏硬度计、拉伸试验机和导电率测试仪等设备对Cu-0.4Mg-xCe合金进行表征。结果表明,Ce能明显降低Cu-0.4Mg-xCe合金的晶粒尺寸,净化Cu基体。Ce的质量分数超过0.2%后,会出现Ce的化合物,Cu-0.4Mg-xCe合金的塑性和导电率降低。Ce的质量分数为0.2%时,合金的综合性能最优。Cu-0.4Mg-0.2Ce合金退火处理后,其维氏硬度、抗拉强度、导电率、软化温度分别为213,548 MPa,75.6%IACS,430℃.

The Cu-0.4Mg-xCe(x=0,0.1,0.2,0.3)alloys were prepared by adding Cu-Ce alloy in Cu-Mg alloy.Cu-0.4Mg-xCe alloys were characterized by scanning electron microscope(SEM),transmission electron microscope(TEM),Vickers hardness tester,tensile testing machine,electrical conductivity tester and other equipments.The results show that Ce can significantly reduce the grain size of the Cu0.4Mg-xCe alloys and purify the Cu matrix.When the mass fraction of Ce exceeds 0.2%,Ce compounds appear,and the plasticity and electrical conductivity of the Cu-0.4Mg-xCe alloys are reduced.When the mass fraction of Ce is 0.2%,the comprehensive properties of the alloy are the best.After annealing treatment,the Vickers hardness,the tensile strength,the electrical conductivity and the softening temperature of the Cu-0.4Mg-0.2Ce alloy are 213,548 MPa,75.6%IACS and 430°C,respectively.