基于生物可降解微流控芯片的跨尺度注塑仿真

Cross-scale injection molding simulation based on biodegradable microfluidic chip

针对聚乳酸(PLA)材料制作微流控芯片时的翘曲变形明显以及微结构收缩形变较大等缺陷,进行了注塑过程的数值仿真以及正交试验的设计,仿真了微注射成型微流控芯片的过程中熔体温度、保压时间、注射时间等参数对成型后翘曲和收缩的影响并进行了优化。结果表明:熔体温度对微结构收缩形变影响较大,保压时间对翘曲变形影响较大。采用优化后跨尺度注塑成型时的相关参数,从而可以实现批量化注塑生产微流控芯片。

Aiming at the defects of obvious warpage deformation and large shrinkage deformation of micro-structure of micro-fluidic chip made of polylactic acid(PLA)material, numerical simulation of injection molding process and the design of orthogonal experiment are carried out. The effects of melt temperature, pressure holding time, injection time and other parameters on warpage and shrinkage after molding in the process of micro-injection molding microfluidic chips are simulated and optimized.The results show that the melt temperature has a great influence on the shrinkage of microstructure, and the pressure holding time has a great influence on the warpage.By optimized the related parameters of cross-scale injection molding, batch injection molding of microfluidic chips can be realized.